Support for high-frequency equipment
Integrated circuits have become finer with electrical parts becoming smaller. This trend makes electrical capacitance between electrical wirings larger and has a possibility to delay the signals.
Also, increasing radio communications have furthered high frequency wave communications. The high frequency radio wave is easily transferred to thermal energy, and then, transmission loss might occur.
To solve these problems, using the materials with low dielectric constant is one of the good solutions.
PBI Advanced Materials develops the materials showing low dielectric constant.